DESCRIPTION :
The Intelligent, Distributed and Embedded Instrumentation Laboratory (LIIDE) is dedicated to developing a hybrid hardware-software platform to design the instrumentation functionalities of the future.
The laboratory works on two complementary fronts:
1. Hardware development, focused on versatile and modular electronic boards together with the necessary software for their operation, in order to cover a wide range of sensor technologies; and
2. Innovative artificial intelligence functionalities for distributed measurement and frugal, decentralized learning.
The Acoustics for Inspection and Characterization Laboratory (LA2C) develops ultrasonic inspection and characterization methods, as well as associated robotics and sensors. It has significant expertise in hardware and software development, as well as current material and industrial problems. Its current principal focus is on ultrasonic imaging for complex industrial scenarios.
These laboratories are embedded within a rich ecosystem centered on digital instrumentation for control, monitoring, and diagnostics. The department it belongs to leverages a broad spectrum of sensors (optical fibers, piezoelectric sensors, eddy-current probes, X-ray systems) as well as cutting-edge experimental platforms. Its main application areas are non-destructive evaluation (NDE) and structural health monitoring (SHM)., Ultrasonic phased-array imaging is a core technology in non-destructive testing (NDT) for detecting defects such as cracks or voids in industrial components. By electronically steering ultrasonic beams, phased arrays generate detailed 3D images of internal structures. The Total Focusing Method (TFM) is the standard reconstruction algorithm, achieving diffraction-limited resolution by coherently summing signals from all emitter-receiver pairs.
However, conventional TFM suffers from key limitations: its resolution is constrained by diffraction and array pitch, grating lobes degrade image quality, and it assumes uniform sound velocity. It also struggles to resolve sub-wavelength defects, limiting its effectiveness in complex or heterogeneous materials.
Recent deep learning methods have improved ultrasonic imaging through denoising and super-resolution, but most operate as black boxes without physical interpretability. They often fail to generalize across array geometries or material conditions.
This internship proposes a physics-informed deep learning framework that integrates physical modeling of ultrasonic propagation into neural architectures. Instead of static delay-and-sum focusing, the approach learns adaptive, reweighted focusing kernels that enhance resolution while maintaining interpretability.
The research is structured around six axes:
1. Reweighted TFM: learn per-pixel focusing weights through supervised or self-supervised training for adaptive, interpretable imaging.
2. Grating-lobe analysis: study array pitch effects and compare learned PSFs with theoretical models.
3. Tiny defect imaging: test the method on sub-wavelength defects using synthetic and experimental data.
4. Coded excitation: train models for artifact-free imaging under simultaneous transmit-receive schemes for faster acquisition.
5. Sound speed estimation: incorporate differentiable beamforming to jointly estimate material properties and focus adaptively.
6. Transformer-based characterization: use multi-angle scattering data and attention mechanisms for defect classification and interpretation.
Expected outcomes include a new interpretable deep model for ultrasonic imaging, quantitative grating-lobe suppression analysis, and demonstration of sub-wavelength defect detection.
This project bridges data-driven learning and physical modeling, leading to more robust, adaptive, and explainable ultrasonic imaging systems. The resulting framework could significantly enhance industrial inspection and structural health monitoring by achieving super-resolution, real-time imaging of complex materials.
Code d'emploi : Ingénieur en Intelligence Artificielle (h/f)
Domaine professionnel actuel : IT R&D Professionals
Niveau de formation : Bac+5
Temps partiel / Temps plein : Plein temps
Type de contrat : Stage/Jeune diplômé
Compétences : Plates-Formes Informatiques, Données Expérimentales, Conception de Matériel, Qualité d'Image, Python (Langage de Programmation), Machine Learning, Tensorflow, Conception et Développement de Logiciel, Pytorch, Deep Learning, Technologies Informatiques, Adaptabilité, Innovation, Acoustique, Algorithmes, Génie Electrique, Physique Appliquée, Échographie Médicale, Instrumentation, Câblage Fibre Optique, Traitement d'Image, Suivi Médical, Antenne Réseau à Commande de Phase, Sciences Physiques, Radiologie Conventionnelle, Conception et Réalisation en Robotique, Ultrason, Tests par Ultrasons, Contrôle non Destructif, Imagerie, Capacités de Démonstration, Technologie des Matériaux, Capteurs, Réalisation de Diagnostiques
Courriel :
internet.saclay@cea.fr
Téléphone :
0160833031
Type d'annonceur : Employeur direct
